Semiconductor device sealed in a resin section and method for manufacturing the same

ABSTRACT

A semiconductor device includes a first semiconductor chip having a pad electrode formed on an upper surface thereof; a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed; a columnar electrode communicating between the upper surface and the lower surface of the resin section with the upper surface and the lower surface of the columnar electrode being exposed on the resin section and at least a part of the side surface of the columnar electrode being covered; and a bonding wire connecting the pad electrode and the columnar electrode with a part of the bonding wire being embedded in the columnar electrode as one end of the bonding wire being exposed on the lower surface of the columnar electrode and the remaining part of the bonding wire being covered with the resin section, and a method for manufacturing the same.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional Application of and claims priority toU.S. patent application Ser. No. 13/052,865, filed on Mar. 21, 2011,which is a Divisional Application of and claims priority to U.S. patentapplication Ser. No. 12/098,248, filed on Apr. 4, 2008, which is basedon Japanese Patent Application No. 2007-098763 filed on Apr. 4, 2007,the entire disclosures of which are hereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to a semiconductor device and a method formanufacturing the same, and more particularly to a semiconductor devicehaving a semiconductor chip being sealed in a resin section and a methodfor manufacturing the same.

BACKGROUND ART

In order to increase a packaging density, technologies to stack aplurality of semiconductor chips have been developed. To efficientlystack semiconductor chips, a circuit formed on a surface of thesemiconductor chip to be electrically connected from an upper surfaceand a lower surface of the semiconductor chip is preferable. Athrough-hole electrode provided on the semiconductor chip enables thecircuit to be connected from the upper surface and the lower surface ofthe semiconductor chip. However, providing the through-hole electrode onthe semiconductor chip in a manufacturing process is not easy.

Consequently, it is conceivable to provide a resin on a side of asemiconductor chip and to provide a through-hole electrode on the resin.Japanese Patent Application Publication No. JP-A-2003-174120(Document 1) discloses a technology to form a through-hole electrode: ona wafer surface, a dicing groove is formed, and with a stud bump, athrough-hole electrode is formed; a semiconductor chip is connected withthe stud bump by a bonding wire; the through-hole electrode and thesemiconductor chip are sealed with a resin; and thereafter, by grindingthe wafer from behind, the through-hole electrode exposing its uppersurface and lower surface is formed.

Japanese Patent Application Publication No. JP-A-2003-7909 (Document 2)discloses another technology to form a through-hole electrode: on awafer surface, a dicing groove is formed and filled with a resin; on theresin, a through-hole is formed; a circuit is connected with thethrough-hole using a wiring; inside the through-hole, a through-holeelectrode is formed; and thereafter, by grinding the wafer from behind,the through-hole electrode exposing its upper surface and tower surfaceis formed.

In the technology disclosed in Document 1, as a through-hole electrodeis formed with a stud bump, a tall through-hole electrode is difficultto form. As a stud bump is stacked in a plurality of layers,manufacturing work is increased and manufacturing cost is increased. Inthe technology disclosed in Document 2, as a wiring for the connectionbetween a through-hole electrode and a circuit is formed, manufacturingwork is increased and manufacturing cost is increased.

SUMMARY OF THE INVENTION

The present invention addresses the aforementioned problems and aims toprovide a semiconductor chip electrically connectable from its uppersurface and lower surface to simplify the manufacturing process of asemiconductor device.

According to a first aspect of the present invention, there is provideda semiconductor device includes: a first semiconductor chip having a padelectrode formed on an upper surface thereof; a resin section sealingthe first semiconductor chip with the upper surface and a side surfaceof the first semiconductor chip being covered and a lower surface of thefirst semiconductor chip being exposed; a columnar electrodecommunicating between the upper surface and the lower surface of theresin section with the upper surface and the lower surface of thecolumnar electrode being exposed on the resin section and at least apart of the side surface of the columnar electrode being covered; and abonding wire connecting the pad electrode and the columnar electrodewith apart of the bonding wire being embedded in the columnar electrodeso that one end of the bonding wire is exposed on the lower surface ofthe columnar electrode and the remaining part of the bonding wire iscovered with the resin section.

According to a second aspect of the present invention, there is provideda method for manufacturing a semiconductor device includes: providing ona supporting plate a first semiconductor chip having a pad electrodeformed on an upper surface thereof; connecting the pad electrode and anupper surface of the supporting plate using a bonding wire; forming onthe supporting plate a columnar electrode with a part of the bondingwire being embedded therein, and a resin section sealing the firstsemiconductor chip, the columnar electrode and the remaining part of thebonding wire, and exposing the upper surface of the columnar electrode;removing the supporting plate; and separating the first semiconductorchip by cutting the resin section along the first semiconductor chip.Accordingly, since the columnar electrode and the pad electrode areconnected with the bonding wire, it is possible to reduce themanufacturing cost.

According to a third aspect of the present invention, there is provideda method for manufacturing a semiconductor device includes: forming agroove on a semiconductor wafer having a pad electrode formed on anupper surface thereof; connecting the pad electrode and a lower surfaceof the groove by a bonding wire; forming on the semiconductor wafer acolumnar electrode with a part of the bonding wire being embeddedtherein, and a resin section sealing the first semiconductor chip, thecolumnar electrode and the remaining part of the bonding wire, embeddingthe groove therein, and exposing the upper surface of the columnarelectrode; forming the first semiconductor chip from the semiconductorwafer by grinding or polishing a lower surface of the semiconductorwafer so as to expose a lower surface of the columnar electrode; andseparating the first semiconductor chip by cutting the resin sectionalong the groove. Accordingly, since the first semiconductor chip isformed from the semiconductor wafer, it is possible to skip the processof arranging the first semiconductor chip. Therefore, the manufacturingcost can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1D are cross sectional views (part 1) showing amanufacturing process of a semiconductor device of a first embodiment ofthe present invention;

FIGS. 2A to 2C are cross sectional views (part 2) showing themanufacturing process of the semiconductor device of the firstembodiment;

FIGS. 3A to 3D are cross sectional views (part 3) showing themanufacturing process of the semiconductor device of the firstembodiment;

FIG. 4A is a cross sectional view of the semiconductor device of thefirst embodiment and FIG. 4B is its plan view viewed through a resinsection with bonding wires and pad electrodes being omitted;

FIG. 5A is a cross sectional view of a modification example of thesemiconductor device of the first embodiment and FIG. 5B is a plan viewviewed through the resin section with the bonding wires and the padelectrodes being omitted;

FIGS. 6A to 6D are cross sectional views showing a manufacturing processof a semiconductor device of a second embodiment;

FIGS. 7A to 7D are cross sectional views (part 1) showing amanufacturing process of a semiconductor device of a third embodiment;

FIGS. 8A to 8C are cross sectional views (part 2) showing themanufacturing process of the semiconductor device of the thirdembodiment;

FIG. 9A is a cross sectional view of the semiconductor device of thethird embodiment, FIG. 9B is a cross sectional view of a semiconductordevice of a modification example of the third embodiment, FIG. 9C is itsplan view viewed through a resin section and FIG. 9D is a plan view of asemiconductor device of another modification example of the thirdembodiment viewed through a resin section;

FIGS. 10A to 10C are cross sectional views (part 1) showing amanufacturing process of a semiconductor device of a fourth embodiment;

FIGS. 11A to 11C are cross sectional views (part 2) showing themanufacturing process of the semiconductor device of the fourthembodiment;

FIGS. 12A to 12C are cross sectional views (part 3) showing themanufacturing process of the semiconductor device of the fourthembodiment;

FIGS. 13A to 13C are cross sectional views (part 4) showing themanufacturing process of the semiconductor device of the fourthembodiment;

FIG. 14 is a plan view of the semiconductor device of the fourthembodiment viewed through a resin section;

FIGS. 15A to 15C are cross sectional views (part 1) showing amanufacturing process of a semiconductor device of a fifth embodiment;

FIGS. 16A to 16C are cross sectional views (part 2) showing themanufacturing process of the semiconductor device of the fifthembodiment;

FIG. 17 is a plan view of the semiconductor device of the fifthembodiment viewed through a resin section; and

FIG. 18A and FIG. 18B are respectively a cross sectional view and a sideview of a semiconductor device of a sixth embodiment.

DETAILED DESCRIPTION

A description will now be given of embodiments of the present inventionwith reference to the accompanying drawings.

First Embodiment

In reference with FIGS. 1A to 3D, a method for manufacturing asemiconductor device of a first embodiment of the present invention isdescribed. Referring to FIG. 1A, on a silicon (Si) substrate 51, analuminum (Al) surface layer 52 is formed and a supporting plate 50composed of the Si substrate 51 and the surface layer 52 is formed. Thesubstrate 51 of the supporting plate 50 may be a substrate of othermaterials and materials having an even surface and being easy to grindare preferable. The surface layer 52 is preferable to be of a conductivematerial with which a bonding wire our/hu connected. On the surfacelayer 52, using a die mount material 54, a first semiconductor chip 10with a pad electrode 12 formed on an upper surface where a circuit isformed is disposed and bonded. The pad electrode 12 is connected withthe surface layer 52 using a bonding wire 32.

Referring to FIG. 1B, photoresist 60 is coated so as to cover the firstsemiconductor chip 10 and the bonding wire 32. Referring to FIG. 1C, byexposure and development, an opening section 62 is formed to have a partof the bonding wire 32 included within. Referring to FIG. 1D, using anelectrolytic plating method feeding an electric power through thesurface layer 52, inside the opening section 62, a columnar electrode 30composed of copper (Cu) is formed. Consequently, in the columnarelectrode 30, a part of the bonding wire 32 is embedded so as to makeone end of the bonding wire 32 exposed on a lower surface of thecolumnar electrode 30.

Referring to FIGS. 2A and 2B, after the photoresist 60 is removed, onthe supporting plate 30, a resin section 40 is formed so as to make thefirst semiconductor chip 10, the columnar electrode 30 and the remainingpart of the bonding wire 32 sealed. The resin section 40 is formed,using a thermosetting epoxy resin, by disposing the supporting plate 50in a mold and by hot pressing. Instead, the seal section 40 is formed byspin coating a resin in liquid form and by heating. Referring to FIG.2C, an upper surface of the resin section 40 is ground until an uppersurface of the columnar electrode 30 is exposed.

Referring to FIG. 3A, the supporting plate 50, the die mount material 54and a rear surface of the first semiconductor chip 10 is removed bygrinding. Consequently, the upper surface and the lower surface of thecolumnar electrode 30 are exposed on the resin section 40. Referring toFIG. 3B, on the upper surface and the tower surface of the columnarelectrode 30, using a non-electrolytic plating method, a metal layer 34composed of a nickel (Ni) layer and a gold (Au) layer is formed. Themetal layer 34 serves as a barrier when forming solder and such on thecolumnar electrode 30. Referring to FIG. 3C, using a dicing method, theresin section 40 is cut out between the first semiconductor chips 10 soas to make aside surface of the columnar electrode 30 exposed and toseparate the first semiconductor chips 10. This completes thesemiconductor device of the first embodiment of the present invention.When cutting the resin section 40, in reference with a modificationexample shown in FIG. 3D, the resin section 40 may be cut not to makethe side surface of the columnar electrode 30 exposed.

FIG. 4A is a cross sectional view of the semiconductor device of thefirst embodiment and FIG. 4B is its plan view. In the semiconductordevice of the first embodiment, on the upper surface of the firstsemiconductor chip 10, the pad electrode 12 which is electricallyconnected with a circuit is formed. The resin section 40 seals the firstsemiconductor chip 10 as the upper surface and side surfaces of thefirst semiconductor chip 10 being covered and the lower surface of thefirst semiconductor chip 10 being exposed. The columnar electrode 30communicates between the upper surface and the lower surface of theresin section 40, and the upper surface, the lower surface and an outerside surface of the columnar electrode 30 are exposed on the resinsection 40 and an inner side surface of the columnar electrode 30 iscovered with the resin section 40. The bonding wire 32 connects the padelectrode 12 with the columnar electrode 30. A part of the bonding wire32 is embedded in the columnar electrode 30 so as to have one end of thebonding wire 32 exposed on the lower surface of the columnar electrode30 and the remaining of the bonding wire 32 section is covered with theresin section 40.

FIG. 5A is across sectional view of a modification example of thesemiconductor device of the first embodiment and FIG. 5B is its planview. In the semiconductor device of the modification example of thefirst embodiment, contrary to the semiconductor device of the firstembodiment, the side surfaces of the columnar electrode 30 aresurrounded by the resin section 40. Other configurations are the same asthose of the first embodiment shown in FIGS. 4A and 4B and theirdescriptions are omitted.

In accordance with the first embodiment and the modification example ofthe first embodiment, as the columnar electrode 30 which is electricallyconnected with the semiconductor chip 10 is exposed on the upper surfaceand the lower surface of the resin section 40, an electrical connectionto the first semiconductor chip 10 can be made from the upper surfaceand the lower surface. Consequently, as described in a sixth embodiment,semiconductor devices can be stacked. Furthermore, a test performedprior to stacking becomes easy. As the columnar electrode 30 is providedon the resin section 40, providing a through-hole electrode on thesemiconductor chip is not required.

As in the first embodiment, when the outer side surface of the columnarelectrode 30 is being exposed on the resin section 40, the firstsemiconductor chip 10 can be connected not only from the upper surfaceand the lower surface but also from the side surface. Meanwhile, as inthe modification example of the first embodiment, when the side surfaceof the columnar electrode 30 is being surrounded by the resin section40, the strength of the resin section 40 is maintained.

As long as a part of the bonding wire 32 is embedded within the columnarelectrode 30, the first semiconductor chip 10 can be electricallyconnected with the columnar electrode 30. However, the bonding wire 32being embedded in the columnar electrode 30 so as to have one end of thebonding wire 32 exposed on the lower surface of the columnar electrode30 is preferable.

As shown in FIG. 1A, the pad electrode 12 is connected with the uppersurface of the supporting plate 50 using the bonding wire 32. As shownin FIGS. 1B to 2C, on the supporting plate 50, the columnar electrode 30and the resin section 40 are formed. In the columnar electrode 30, apart of the bonding wire 32 is embedded. The resin section 40 seals thefirst semiconductor chip 10, the columnar electrode 30 and the remainingpart of the bonding wire 32 and the upper surface of the columnarelectrode 30 is exposed on the resin section 40. As shown in FIG. 3A,the supporting plate 50, the die mount material 54 and the back surfaceof the semiconductor chip 10 is removed by grinding. In theabovementioned manufacturing method, the columnar electrode 30 can beformed, for example, by plating method. Consequently, compared with thetechnology which uses a stud bump as described in Document 1, themanufacturing cost can be cut down. As the connection of the columnarelectrode 30 and the pad electrode 12 is made using the bonding wire 32,a process to form a wiring as described in Document 2 can be skipped.Consequently, the manufacturing cost is cut down.

The method for forming the columnar electrode 30 and the resin section40 is as follows. As shown in FIG. 1D, on the supporting plate 50, thecolumnar electrode 30 is formed so as to have apart of the bonding wire32 embedded. As shown in FIG. 2B, the resin section 40 is formed so asto make the first semiconductor chip 10, the remaining part of thebonding wire 32 and the columnar electrode 30 sealed. As shown in FIG.2C, the upper surface of the resin section 40 is ground so as to makethe upper surface of the columnar electrode 30 exposed. This completesthe forming of the columnar electrode 30 and the resin section 40.

Second Embodiment

A second embodiment of the present invention is an instance of using amask for forming a columnar electrode as a resin section. Referring toFIGS. 6A to 6D, a method for manufacturing a semiconductor device of thesecond embodiment is described. Referring to FIG. 6A, after conductingprocesses shown in FIG. 1A of the first embodiment, an as to make afirst semiconductor chip 10 and a bonding wire 32 covered, a resinsection 40 a is formed by spin coating a photosensitive thermosettingepoxy resin. Referring to FIG. 69, by performing a light exposure anddevelopment, on the resin section 40 a, a through-hole 48 which includesa part of the bonding wire 32 is formed. By a heat process, the resinsection 40 a is hot cured. Referring to FIG. 6C, by supplying anelectric current through a surface layer 52, inside the through-hole 48,a columnar electrode 30 composed of Cu is formed using an electrolyticplating method. Referring to FIG. 6D, similar to those in FIG. 3A of thefirst embodiment, a supporting plate 50, a die mount material 54 and aback surface of the semiconductor chip 10 are ground and removed.Thereafter, by performing the processes in FIGS. 38 and 3C of the firstembodiment, the semiconductor device of the second embodiment iscompleted.

In accordance with the second embodiment, as shown in FIGS. 6A and 6B,the resin section 40 a having the through-hole 48 in which a columnarelectrode is formed is formed, and as shown in FIG. 6C, inside thethrough-hole 48, the columnar electrode 30 is formed. Consequently, thecolumnar electrode 30 and the resin section 40 a are formed. Therefore,compared with those of the first embodiment, a peeling process of aphotoresist 60 in FIG. 2A, a forming process of a resin section 40 inFIG. 2B and a grinding process of the resin section 40 in FIG. 2C arenot required. Consequently, the manufacturing process is cut down.However, in the second embodiment, the resin section 40 a is required touse a resin which is photosensitive and is available for spin coating.For this reason, the options for selecting materials for the resinsection 40 a become small. Therefore, to expand the options forselecting materials for the resin section 40 a, for example to select bycost and property of resin, it is preferable to use the firstembodiment.

Third Embodiment

A third embodiment of the present invention is an instance of a secondsemiconductor chip being bonded on a first semiconductor chip 10 byflip-chip bonding, hereinafter abbreviated as FCB. Referring to FIGS. 7Ato 8C, a method for manufacturing a semiconductor device of the thirdembodiment is described. Referring to FIG. 7A, the processes similar tothose in FIG. 1A of the first embodiment are performed. A bonding wire32 is formed so as to be arranged in two rows on the outer side of afirst semiconductor chip 10. In FIG. 8A, while two bonding wires 32 areshown superposed, the bonding wires 32 are provided separately in adepth direction of the drawing in FIG. 8A as shown in later describedFIG. 9C.

Referring to FIG. 7B, similar to those in FIGS. 1B to 2A of the firstembodiment, on a supporting plate 50, a columnar electrode 30 is formedso as to have a part of the bonding wire 32 embedded. Referring to FIG.7C, on the first semiconductor chip 10, second semiconductor chips 22and 24 are bonded by FCB. Consequently, a pad electrode 16 formed on anupper surface of the first semiconductor chip 10 and pad electrodes 26formed on lower surfaces, i.e. the surfaces on which circuits areformed, of the second semiconductor chips 22 and 24 are connected by abump 56. Referring to FIG. 7D, similar to those in FIG. 2B of the firstembodiment, a resin section 40 is formed so as to make the firstsemiconductor chip 10, the second semiconductor chips 22 and 24, thecolumnar electrode 30 and the bonding wire 32 sealed.

Referring to FIG. 8A, the resin section 40 and the second semiconductorchips 22 and 24 are ground so as to expose upper surfaces of the secondsemiconductor chips 22 and 24 and an upper surface of the columnarelectrode 30. Referring to FIG. 8B, similar to those in FIG. 2B of thefirst embodiment, a supporting plate 50, a die mount material 54 and aback surface of the first semiconductor chip 10 are removed by grinding.Consequently, a lower surface of the columnar electrode 30 and a lowersurface of the first semiconductor chip 10 are exposed. Referring toFIG. 8C, similar to those in FIG. 2C of the first embodiment, on theupper surface undo lower surface of the columnar electrode 30, a metallayer 34 is formed. Thereafter, similar to those in FIG. 3C or 3D of thefirst embodiment, the resin section 40 is cut by a dicing method and thesemiconductor device of the third embodiment is completed.

FIG. 9A is a cross sectional view of the semiconductor device of thethird embodiment, FIG. 9B is a cross sectional view of a modificationexample of the third embodiment, and FIG. 9C is a plan view of thesemiconductor device of the modification example of the third embodimentviewed through a resin section 40. FIG. 9D is a plan view of asemiconductor device of another modification example of the thirdembodiment viewed through a resin section 40. As shown in FIG. 9A, anouter side surface of the columnar electrode 30 may be exposed on theresin section 40 or, as shown in FIG. 9B, a side surface of a columnarelectrode 30 may be surrounded by the resin section 40. Referring toFIG. 9C, a pad electrode 12 and the columnar electrode 30 areappropriately connected using a bonding wire 32. As shown in FIG. 9D, ina depth direction of the drawing in FIG. 8A, a columnar electrode 30 maybe alternately provided on an inner row and an outer row of a firstsemiconductor chip 10.

In accordance with the third embodiment, the second semiconductor chips22 and 24 are bonded by FCB on the first semiconductor chip 10 withtheir lower surfaces and side surfaces being covered with the resinsection 40 and their upper surfaces being exposed on the resin section40. As described above, the second semiconductor chips 22 and 24 can beelectrically connected, through a wiring (not shown) formed on the firstsemiconductor chip 10, with the columnar electrode 30. Therefore, fromthe upper surface and the lower surface of the columnar electrode 30, inaddition to the first semiconductor chip 10, the second semiconductorchips 22 and 24 can be electrically connected. Consequently, thepackaging density of the semiconductor chips is improved.

As shown in FIG. 7C, on the first semiconductor chip 10, the secondsemiconductor chips 22 and 24 are bonded by FCB. As shown in FIG. 8A, soas to have the upper surfaces of the second semiconductor chips 22 and24 exposed, the resin section 40 is formed. When exposing the secondsemiconductor chips 22 and 24 on the resin section 40, as shown in FIG.8A, it is preferable to grind, together with the resin section 40, theupper surfaces of the second semiconductor chips 22 and 24. When bondingthe semiconductor chip by FCB, as handling of the semiconductor chipbecomes difficult, it is difficult to make a thickness of thesemiconductor to be less than 100 μm. In accordance with the thirdembodiment, as the upper surfaces of the second semiconductor chips 22and 24 are ground together with the resin section 40, the chip thicknessof the second semiconductor chips 22 and 24 can be made thin.Consequently, the packaging density of the semiconductor chips isimproved.

In the third embodiment, while two pieces of the second semiconductorchips 22 and 24 are bonded by FCB onto a single piece of the firstsemiconductor chip 10, a single piece or pieces of three or more of thesecond semiconductor chips may be bonded by FCB. In the semiconductordevices of the first embodiment and the second embodiment, similar tothe third embodiment, the columnar electrodes 30 may be formed in two ormore rows on an outer side of the first semiconductor chip 10.

Fourth Embodiment

A fourth embodiment of the present invention is an instance ofmanufacturing a semiconductor device using a semiconductor wafer withoutusing a supporting plate. Referring to FIGS. 10A to 13C, a method formanufacturing a semiconductor device of the fourth embodiment isdescribed. Referring to FIG. 10A, on a semiconductor wafer 11 on which apad electrode 16 is formed on an upper surface where a circuit isformed, a groove 18 is formed. The groove 18 is formed by half-dicingand its width w1 is, for example 120 μm and its depth t1 is, for example100 μm. As described later, the groove 18 is formed, so as to have afirst semiconductor chip 10 to be formed on the semiconductor wafer 11,on the periphery of a circuit (not shown) in a grid pattern.

Referring to FIG. 10B, on a lower surface of the groove 18, a conductivelayer 33 composed of Al is vapor deposited. The conductive layer 33 ispreferable to be connectable with a bonding wire and to have electricalconductivity. Referring to FIG. 10C, on the semiconductor wafer 11, asecond semiconductor chip 20 is bonded by FCB. Consequently, the padelectrode 16 formed on the upper surface of the semiconductor wafer 11and a pad electrode 26 formed on the lower surface of the secondsemiconductor chip 20 where a circuit is formed are connected by a bump56.

Referring to FIG. 11A, a pad electrode 12 arranged on both sides of thegroove 18 and the conductive layer 33 on the lower surface of the groove18 are connected using a bonding wire 32. Referring to FIG. 11B, similarto those in FIG. 2B of the first embodiment, a resin section 40 a isformed using a resin which is photosensitive and available for spincoating so as to seal the second semiconductor chip 20 and the bondingwire 32 and to fill the groove 18. Referring to FIG. 11C, the secondsemiconductor chip 20 and the resin section 40 a are ground.Consequently, an upper surface of the second semiconductor 20 isexposed.

Referring to FIG. 12A, in the resin section 40 a above the groove 18 ofthe semiconductor wafer 11, a through-hole 42 which includes a part ofthe bonding wire 32 is formed. Referring to FIG. 12B, by supplying anelectric current through the conductive layer 33, inside thethrough-hole 42, a columnar electrode 30 composed of Cu is formed usingan electrolytic plating method. In this case, as the conductive layer 33is formed in a grid pattern, the electric current for plating can besupplied from the periphery of the semiconductor wafer 11. Referring toFIG. 12C, so as to make the resin section 40 a and an upper surface ofthe columnar electrode 30 flat, the second semiconductor 20 and theresin section 40 a are ground, in FIG. 12B, when a step between theresin section 40 a and the upper surface of the columnar electrode 30 isslight enough not to cause problems, the process in FIG. 12C may not beperformed.

Referring to FIG. 13A, a lower surface of the semiconductor wafer 11 isground so as to expose a lower surface of the columnar electrode 30.Consequently, from the semiconductor wafer 11, the mutually detachedfirst semiconductor chips 10 are formed. Referring to FIG. 13B, on theupper surface and the lower surface of the columnar electrode 30, ametal layer 34 composed of a Ni layer and a Cu layer is formed using anon-electrolytic plating method. Referring to FIG. 13C, along the groove18, the columnar electrode 30 and the resin section 40 a are cut off.Consequently, the first semiconductor chips 10 are separated. Whenseparating the first semiconductor chips 10, a dicing method is usedusing a blade of narrower width than that of the blade used in halfdicing in FIG. 10A.

FIG. 14 is a plan view of the semiconductor device of the fourthembodiment viewed through the resin section. As the columnar electrode30 is cut off, the outer side surface of the columnar electrode 30 isexposed on the resin section 40 a.

In accordance with the fourth embodiment, as shown in FIG. 10A, on thesemiconductor wafer 11 where the pad electrode 12 is formed on the uppersurface thereof, the groove 18 is formed. As shown in FIG. 11A, the padelectrode 12 and the lower surface of the groove 18 are connected usingthe bonding wire 32. As shown in FIGS. 11B to 12C, the columnarelectrode 30 and the resin section 40 a are formed. The columnarelectrode 30 is formed so as to have a part of the bonding wire 32embedded on the groove 18. The resin section 40 a is formed so as toseal the first semiconductor chip 10, the columnar electrode 30 and theremaining part of the bonding wire 32 and to expose the upper surface ofthe columnar electrode 30. As shown in FIG. 13A, the lower surface ofthe semiconductor wafer 11 is ground so as to expose the lower surfaceof the columnar electrode 30 and, from the semiconductor wafer 11, thefirst semiconductor chip 10 is formed. As just described above, withoutusing a supporting plate 50 as in the cases used in the first to thirdembodiments, by forming the groove 18 on the semiconductor wafer 11, asemiconductor device can be manufactured. While a process to arrange thefirst semiconductor chip 10 on the supporting plate 50 is required inaccordance with the first to third embodiments, in accordance with thefourth embodiment, this process can be skipped.

In accordance with the fourth embodiment, on the first semiconductorchip 10, the second semiconductor chip 20 may not be bonded by FCB. Onthe contrary, onto a single piece of the first semiconductor chip 10,two or more of the second semiconductor chips 20 may be bonded by FCB.

In the fourth embodiment, the columnar electrode 30 and the resinsection 40 a are formed in the way similar to those in the secondembodiment. More specifically, as shown in FIGS. 11B to 12A, the resinsection 40 a is formed having the through-hole 42 in which the columnarelectrode 30 to be formed, and as shown in FIGS. 12B and 12C, inside thethrough-hole 42, the columnar electrode 30 is formed.

However, the columnar electrode 30 and the resin section 40 a may beformed in the way similar to those in the first embodiment. Morespecifically, the columnar electrode 30 is formed so as to have a partof the bonding wire 32 embedded on the lower surface of the groove 18;the resin section 40 a is formed so as to seal the first semiconductorchip 10, the remaining part of the bonding wire 32 and the columnarelectrode 30; and the upper surface of the resin section 40 a is groundso as to expose the upper surface of the columnar electrode 30. In theway described above, the columnar electrode 30 and the resin section 40a may be formed.

Further, as shown in FIGS. 12A and 12B, the columnar electrode 30 isformed so as to embed a plurality of bonding wires 32 which respectivelyconnect the pad electrodes 12 of different first semiconductor chipswith the lower surface of the groove 18. As shown in FIG. 13C, whenseparating the first semiconductor chips 10, the columnar electrode 30is cut off so as to have a plurality of bonding wires 32 respectivelybelonged to the different semiconductor chips 10. Consequently, as shownin FIG. 14, the side surface of the columnar electrode 30 is exposed onthe resin section 40 a.

Fifth Embodiment

A fifth embodiment of the present invention is an instance of forming acolumnar electrode for each bonding wire. Referring to FIG. 15A, thesame processes as those in FIGS. 10A to 11C of the fourth embodiment areperformed. Thereafter, on a groove 18, a through-hole 42 a on a resinsection 40 a is formed so as to include the bonding wire 32 in eachhole. Referring to FIG. 15B, similar to those in FIG. 12B of the fourthembodiment, inside the through-hole 42 a, a columnar electrode 30 acomposed of Cu is formed. Referring to FIG. 15C, similar to those inFIG. 12C of the fourth embodiment, so as to make upper surfaces of thecolumnar electrode 30 a and the resin section 40 a flat, an uppersurface of the resin section 40 a is ground.

Referring to FIG. 16A, similar to those in FIG. 13A of the fourthembodiment, by grinding a lower surface of a semiconductor wafer 11 soas to expose a lower surface of the columnar electrode 30 a, a firstsemiconductor chip 10 is formed. Referring to FIG. 16B, similar to thosein FIG. 13B of the fourth embodiment, on the upper surface and the lowersurface of the columnar electrode 30 a, a metal layer 34 is formed.Referring to FIG. 16C, by cutting off the resin section 40 a, thesemiconductor chip 10 is separated.

FIG. 17 is a plan view of the semiconductor device of the fifthembodiment viewed through the resin section. As the resin section 40 abetween the columnar electrodes 30 is cut off, a side surface of thecolumnar electrode 30 is surrounded by the resin section 40 a.

In accordance with the fifth embodiment, as shown in FIGS. 15A to 15C,the columnar electrode 30 is formed so as to respectively embed indifferent columnar electrodes 30 a plurality of bonding wires 32 whichrespectively connects the pad electrodes 12 of different firstsemiconductor chips 10 with the lower surface of the groove 18. As shownin FIG. 16C, by cutting off a semiconductor wafer 11 so as to make thedifferent columnar electrodes 30 a respectively belonged to thedifferent first semiconductor chips 10, the first semiconductor chip 10is separated. In the manufacturing method described above, as shown inFIG. 17, the periphery of the columnar electrode 30 is surrounded by theresin section 40 a. As the columnar electrode 30 a is not being cut off,a deterioration of blade from metal is restrained.

Sixth Embodiment

A sixth embodiment of the present invention is an instance of stackingsemiconductor devices of the fifth embodiment. FIG. 18A is a crosssectional view of a semiconductor device of the sixth embodiment andFIG. 18B is its side view. By arranging a solder paste 70 betweencolumnar electrodes 30 of semiconductor devices 100 above and below, thesemiconductor devices 100 are stacked. The solder paste 70 is reflowed.In accordance with the sixth embodiment, a plurality of firstsemiconductor chips 10 are stacked as the columnar electrodes 30 of thesemiconductor chips 10 above and below being superposed. In place of thesemiconductor devices of the fifth embodiment, the semiconductor devicesof the first to fourth embodiments may be stacked. Consequently, as theupper surface and the lower surface of the columnar electrode 30 of thesemiconductor devices of the first to fifth embodiments are exposed onthe resin section 40 a, the semiconductor devices of the first to fifthembodiments can be stacked.

In the first to fifth embodiments, while examples are of the columnarelectrode 30 being composed of Cu, as long as being conductive, thecolumnar electrode 30 may be composed of other materials. For example,solder may be used.

In the first to fifth embodiments, while examples of grinding the resinsection 40 and the second semiconductor chip 20 or the semiconductorwafer 11 are described, in place of grinding, polishing may be used.

Now, several aspects of the present invention are summarized as follows.

According to a first aspect of the present invention, there is provideda semiconductor device includes: a first semiconductor chip having a padelectrode formed on an upper surface thereof; a resin section sealingthe first semiconductor chip with the upper surface and a side surfaceof the first semiconductor chip being covered and a lower surface of thefirst semiconductor chip being exposed; a columnar electrodecommunicating between the upper surface and the lower surface of theresin section with the upper surface and the lower surface of thecolumnar electrode being exposed on the resin section and at least apart of the side surface of the columnar electrode being covered; and abonding wire connecting the pad electrode and the columnar electrodewith a part of the bonding wire being embedded in the columnar electrodeso that one end of the bonding wire is exposed on the lower surface ofthe columnar electrode and the remaining part of the bonding wire iscovered with the resin section. Accordingly, since the columnarelectrode electrically connected to the first semiconductor chip isexposed on the upper surface and the lower surface of the resin section,it is possible to electrically connect the columnar electrode to thefirst semiconductor chip from the upper surface and the lower surface ofthe columnar electrode. Also, since the first semiconductor chip and thecolumnar electrode are connected by the bonding wire, the manufacturingprocess is simple, and it is therefore possible to reduce themanufacturing cost. In the above arrangement, the side surface of thecolumnar electrode may be surrounded by the resin section. It istherefore possible to maintain the strength of the resin section.

In the above arrangement, an outer side surface of the columnarelectrode may be exposed on the resin section. It is therefore possibleto electrically connect the columnar electrode to the firstsemiconductor chip from the side surface of the columnar electrode.

In the above arrangement, a metal film may be formed on the uppersurface and the lower surface of the columnar electrode.

In the above arrangement, a second semiconductor chip may be bonded byflip-chip bonding on the first semiconductor chip with a lower surfaceand a side surface of the second semiconductor chip being covered withthe resin section and an upper surface of the second semiconductor chipbeing exposed on the resin section. It is therefore possible to improvethe packaging density of the semiconductor chip.

In the above arrangement, the columnar electrode may be made of copperor solder.

In the above arrangement, the first semiconductor chip may be providedin plurality and such semiconductor chips may be stacked so as tosuperpose the columnar electrodes for the first semiconductor chipsabove and below. It is therefore possible to stack the plurality offirst semiconductor chips. Accordingly, the packaging density of thesemiconductor chip can be improved.

According to a second aspect of the present invention, there is provideda method for manufacturing a semiconductor device includes: providing ona supporting plate a first semiconductor chip having a pad electrodeformed on an upper surface thereof; connecting the pad electrode and anupper surface of the supporting plate using a bonding wire; forming onthe supporting plate a columnar electrode with a part of the bondingwire being embedded therein, and a resin section sealing the firstsemiconductor chip, the columnar electrode and the remaining part of thebonding wire, and exposing the upper surface of the columnar electrode;removing the supporting plate; and separating the first semiconductorchip by cutting the resin section along the first semiconductor chip.Accordingly, since the columnar electrode and the pad electrode areconnected with the bonding wire, it is possible to reduce themanufacturing cost.

The above method may also include: flip-chip bonding a secondsemiconductor chip on the first semiconductor chip; and forming thecolumnar electrode and the resin electrode may include: forming theresin section so as to expose an upper surface of the secondsemiconductor chip. Accordingly, it is possible to improve the packagingdensity of the semiconductor chip.

In the above method, forming the columnar electrode and the resinsection may include: forming the resin section having a through-hole inwhich the columnar electrode is to be formed; and forming the columnarelectrode in the through-hole. Accordingly, since the resin section isused as a mask to form the columnar electrode, it is possible to reducethe manufacturing cost.

In the above method, forming the columnar electrode and the resinsection may include: forming on the supporting plate the columnarelectrode so as to embed apart of the bonding wire therein; forming, theresin section so as to seal the first semiconductor chip, the remainingpart of the bonding wire and the columnar electrode; and grinding orpolishing an upper surface of the resin section so as to expose theupper surface of the columnar electrode.

According to a third aspect of the present invention, there is provideda method for manufacturing a semiconductor device includes; forming agroove on a semiconductor wafer having a pad electrode formed on anupper surface thereof; connecting the pad electrode and a lower surfaceof the groove by a bonding wire; forming on the semiconductor wafer acolumnar electrode with a part of the bonding wire being embeddedtherein, and a resin section sealing the first semiconductor chip, thecolumnar electrode and the remaining part of the bonding wire, embeddingthe groove therein, and exposing the upper surface of the columnarelectrode; forming the first semiconductor chip from the semiconductorwafer by grinding or polishing a lower surface of the semiconductorwafer so as to expose a lower surface of the columnar electrode; andseparating the first semiconductor chip by cutting the resin sectionalong the groove. Accordingly, since the first semiconductor chip isformed from the semiconductor wafer, it is possible to skip the processof arranging the first semiconductor chip. Therefore, the manufacturingcost can be reduced.

The above method may also include: flip-chip bonding a secondsemiconductor chip on the semiconductor wafer; and forming the columnarelectrode and the resin section may include: forming the resin sectionso as to expose an upper surface of the second semiconductor chip.Accordingly, it is possible to improve the packaging density of thesemiconductor chip.

In the above method, forming the columnar electrode and the resinsection may include: forming the resin section having a through-hole inwhich the columnar electrode is to be formed; and forming the columnarelectrode in the through-hole. Accordingly, since the resin section isused as a mask to form the columnar electrode, it is possible to reducethe manufacturing cost.

In the above method, forming the columnar electrode and the resinsection may include: forming on a lower surface of the groove thecolumnar electrode so as to embed the part of the bonding wire therein;forming the resin section so as to seal the first semiconductor chip,the remaining part of the bonding wire and the columnar electrode; andgrinding or polishing an upper surface of the resin section so as toexpose the upper surface of the columnar electrode.

In the above method, forming the columnar electrode and the resinsection may include: forming the columnar electrode by embedding aplurality of bonding wires that respectively connect the pad electrodeof individual first semiconductor chips with the lower surface of thegroove; and separating the first semiconductor chip may include: cuttingthe columnar electrode so that the plurality of bonding wiresrespectively belong to the individual first semiconductor chips. In theabove method, forming the columnar electrode and the resin section mayinclude: forming the columnar electrode so as to respectively embed indifferent columnar electrodes a plurality of bonding wires thatrespectively connects the pad electrode of the individual firstsemiconductor chips with the lower surface of the groove; and separatingthe first semiconductor chip may include: cutting the columnar electrodeso that the different columnar electrodes respectively belong to thedifferent first semiconductor chips.

In the above method, the columnar electrode may be formed by a platingmethod. Accordingly, it is possible to simply embed the bonding wire tothe columnar electrode.

The above method may also include: stacking the plurality of firstsemiconductor chips so as to superpose the columnar electrode of thefirst semiconductor chip above and below. Accordingly, it is possible toimprove the packaging density of the semiconductor chip.

As described above, as the columnar electrode which is electricallyconnected to the first semiconductor chip is exposed on the uppersurface and the lower surface of the resin section, it is possible toelectrically connect the columnar electrode to the first semiconductorchip from the upper surface and the lower surface of the columnarelectrode. As the columnar electrode is connected with the firstsemiconductor chip by the bonding wire, the manufacturing processbecomes simple and the manufacturing cost is cut down.

While the preferred embodiments of the present invention have beendescribed in details above, the present invention is not limited tothose specific embodiments, and within the spirit and scope of thepresent invention, various modifications and alterations can be made.

I claim:
 1. A method for manufacturing a semiconductor devicecomprising: forming a groove on a semiconductor wafer having a padelectrode formed on an upper surface thereof; connecting the padelectrode and a lower surface of the groove by a bonding wire; formingon the semiconductor wafer a columnar electrode with a part of thebonding wire being embedded therein, and a resin section sealing thecolumnar electrode, the remaining part of the bonding wire and thesemiconductor wafer, embedding the groove therein, and exposing theupper surface of the columnar electrode; forming a first semiconductorchip from the semiconductor wafer by: grinding or polishing a lowersurface of the semiconductor wafer so as to expose a lower surface ofthe columnar electrode; and separating the first semiconductor chip fromthe semiconductor wafer by cutting the resin section and columnarelectrode along the groove.
 2. The method according to claim 1, whereina side surface of the columnar electrode is surrounded by the resinsection.
 3. The method according to claim 1, wherein an outer surface ofthe columnar electrode is exposed on the resin section.
 4. The methodaccording to claim 1, further comprising forming a metal film on theupper surface and the lower surface of the columnar electrode.
 5. Themethod according to claim 1, further comprising bonding a secondsemiconductor chip flip-chip on the semiconductor wafer where the firstsemiconductor chip is to be formed, with a lower surface and a sidesurface of the second semiconductor chip being covered with the resinsection and an upper surface of the second semiconductor chip beingexposed on the resin section.
 6. The method according to claim 1,wherein the columnar electrode is made of copper or solder.
 7. Themethod according to claim 1, wherein the first semiconductor chip isprovided in plurality and such first semiconductor chips are stacked soas to superpose the columnar electrodes for the first semiconductorchips above and below.
 8. A method for manufacturing a semiconductordevice comprising: forming a groove on a semiconductor wafer having apad electrode formed on an upper surface thereof; connecting the padelectrode and a lower surface of the groove by a bonding wire; sealingwith a resin section the bonding wire and the semiconductor wafer;forming a through-hole in the resin section exposing part of the bondingwire; forming inside the through-hole a columnar electrode with theexposed part of the bonding wire being embedded therein; forming a firstsemiconductor chip from the semiconductor wafer by: grinding orpolishing a lower surface of the semiconductor wafer so as to expose alower surface of the columnar electrode; and separating the firstsemiconductor chip from the semiconductor wafer by cutting the resinsection and columnar electrode along the groove.
 9. The method accordingto claim 8, wherein forming the through-hole comprises exposing aconductive layer on a lower surface of the groove to which the padelectrode is connected by the bonding wire, and wherein the columnarelectrode is formed using an electrolytic plating method by supplying anelectric current through the conductive layer.
 10. The method accordingto claim 8, further comprising prior to sealing with the resin sectionbonding a second semiconductor chip flip-chip on the semiconductor waferwhere the first semiconductor chip is to be formed, with a lower surfaceand a side surface of the second semiconductor chip being covered withthe resin section and an upper surface of the second semiconductor chipbeing exposed on the resin section.
 11. The method according to claim 8,wherein the columnar electrode is made of copper or solder.
 12. Themethod according to claim 8, wherein the first semiconductor chip isprovided in plurality and such first semiconductor chips are stacked soas to superpose the columnar electrodes for the first semiconductorchips above and below.
 13. A method for manufacturing a semiconductordevice comprising: forming a groove on a semiconductor wafer having afirst and second pad electrodes formed on an upper surface thereof, thefirst and second pad electrodes separated by the groove; connecting thefirst and second pad electrodes and a lower surface of the groove by afirst and second bonding wires; sealing with a resin section the firstand second pad electrodes, first and second bonding wires and thesemiconductor wafer; forming in the groove through the resin section afirst through-hole exposing part of the first bonding wire and a secondthrough-hole exposing part of the second bonding wire, wherein the firstthrough-hole is separated from the second through-hole by the resinsection remaining in the groove; forming inside the first through-hole afirst columnar electrode with the exposed part of the first bonding wirebeing embedded therein, and inside the second through-hole a secondcolumnar electrode with the exposed part of the second bonding wirebeing embedded therein; forming a first semiconductor chip from thesemiconductor wafer by: grinding or polishing a lower surface of thesemiconductor wafer so as to expose lower surfaces of the first andsecond columnar electrodes; and separating the first semiconductor chipfrom the semiconductor wafer by cutting the resin section remaining inthe groove and separating the first and second columnar electrodes. 14.The method according to claim 13, wherein forming the first and secondthrough-holes comprise exposing a conductive layer on a lower surface ofthe groove to which the first and second pad electrodes are connected bythe first and second bonding wires, and wherein the first and secondcolumnar electrodes are formed using an electrolytic plating method bysupplying an electric current through the conductive layer.
 15. Themethod according to claim 13, further comprising prior to sealing withthe resin section bonding a second semiconductor chip flip-chip on thesemiconductor wafer where the first semiconductor chip is to be formed,with a lower surface and a side surface of the second semiconductor chipbeing covered with the resin section and an upper surface of the secondsemiconductor chip being exposed on the resin section.